Quantity | 3+ units | 10+ units | 30+ units | 50+ units | More |
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Price /Unit | $129.37 | $126.73 | $122.77 | $117.49 | Contact US |
3-In-1 Preheater Station Motherboard Layered Welding Dismantling CH5 Host + CH5-A Groove For iPhone X/XS/XS-MAX
Description:
3-In-1 Motherboard Desoldering Preheater Platform is for iPhone X/XS/XS-MAX. It supports for A11 A12 CPU chip, A11 A12 HHD, iPhone X Baseband, iPhone XS/XS-MAX baseband and glue removal.
Features:
- Double heating cores: the first in the industry to adopt double heating core
- Intelligent protection: standby for 15 minutes; automatic power-off protection
- Laminated board structure: a new innovation in the industry, with uniform downward force in parallel
- Make your maintenance easier
- Efficient: 3 minutes to 183°C; 3 minutes to desolder; 3 minutes to fit
- Bending plate correction: A deformed main board is effectively corrected by the CH5 bonding structure
- Comprehensive functions: in addition to desoldering, lamination, and correction, it also supports CPU, hard disk IC, and baseband IC glue removal
- Integrated design of layered bonding and desoldering
- Digital display shows temperature clearly
- Safe disassembly and do no damage to your motherboards
Package Included:
- 1 x Set of Preheater Station