• 3-In-1 Preheater Station Motherboard Layered Welding Dismantling CH5 Host + CH5-BC Groove For iPhone 11/11 Pro/11 Pro-Max
  • 3-In-1 Preheater Station Motherboard Layered Welding Dismantling CH5 Host + CH5-BC Groove For iPhone 11/11 Pro/11 Pro-Max

3-In-1 Preheater Station Motherboard Layered Welding Dismantling CH5 Host + CH5-BC Groove For iPhone 11/11 Pro/11 Pro-Max

Availability: In stock, usually dispatched in 1 business day

  • Price:$141.88
  • Price in reward points: 1419 Reward Points: 14
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    Price /Unit $139.04 $136.20 $131.95 $126.27 Contact US
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3-In-1 Preheater Station Motherboard Layered Welding Dismantling CH5 Host + CH5-BC Groove For iPhone 11/11 Pro/11 Pro-Max

Features:

- With a CH5-BC groove for iPhone 11/11 Pro/11 Pro-Max
- Double heating cores: the first in the industry to adopt double heating core
- Intelligent protection: standby for 15 minutes; automatic power-off protection
- Laminated board structure: a new innovation in the industry, with uniform downward force in parallel
- Make your maintenance easier
- Efficient: 3 minutes to 183°C; 3 minutes to desolder; 3 minutes to fit
- Bending plate correction: A deformed main board is effectively corrected by the CH5 bonding structure
- Comprehensive functions: in addition to desoldering, lamination, and correction, it also supports CPU, hard disk IC, and baseband IC glue removal
- Integrated design of layered bonding and desoldering
- Digital display shows temperature clearly
- Safe disassembly and do no damage to your motherboards

Package Included:

- 1 x Set of Preheater Station

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